Warpage of Flexible OLED under High Temperature Reliability Test
نویسندگان
چکیده
منابع مشابه
High Gas Barrier Adhesives as Encapsulation for Flexible OLED
For the several decade years, organic light-emitting diodes (OLEDs) have been intensively studied because of their potential applicability to large-size flat panel displays, and more recently also solid-state lighting [1-4]. However, the lifetimes of the organic electronic devices are one of the most matters for the practical use of such devices, because of the ambient moisture and oxygen immed...
متن کاملdegradation of oil impregnated paper insulation under influence of repetitive fast high voltage impulses
در طی سالهای اخیراستفاده ازمنابع انرژی تجدید پذیر در شبکه های مدرن بنا به دلایل زیست محیطی و اقتصادی به طور گسترده استفاده شده است همچون نیروگاههای بادی و خورشیدی .ولتاژتولیدی این نیروگاهها اغلب به فرم dc می باشد وادوات الکترونیک قدرت به عنوان مبدل و پل بین شکل موج dc وac استفاده می شوند.این پروسه باعث ایجاد پالسهایی برروی شکل موج خروجی می شود که می تواند وارد تجهیزات قدرت همچون ترانسفورماتور ی...
15 صفحه اولThin film encapsulation for flexible AM-OLED
Flexible organic light emitting diode (OLED) will be the ultimate display technology to customers and industries in the near future but the challenges are still being unveiled one by one. Thin-film encapsulation (TFE) technology is the most demanding requirement to prevent water and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance ...
متن کاملHigh temperature reliability of power module substrates
The thermal cycling reliability of candidate copper and aluminium power substrates has been assessed for use at temperatures exceeding 300°C peak using a combination of thermal cycling, nanoindentation and finite element modelling to understand the relative stresses and evolution of the mechanical properties. The results include the relative cycling lifetimes up to 350°C, demonstrating almost a...
متن کاملCharacterization of high-voltage IGBT module degradations under PWM power cycling test at high ambient temperature
The success of the high temperature power electronic applications depends on the power device reliability. The increasing thermal demands, like in hybrid electric cars, require power devices operating at junction temperatures above their common level of 125 C. The thermal cycles generated in standard modules in such conditions induce several failure mechanisms in their package and chips. This a...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2016
ISSN: 1226-9360
DOI: 10.6117/kmeps.2016.23.1.017